SiCarrier, China’s largest chip equipment manufacturer, has rolled out an impressive array of chipmaking tools aimed at elevating the country’s semiconductor production capabilities.
SiCarrier, recognized as a leader in China’s chip manufacturing tool industry, is emerging as a formidable competitor against global giants like ASML. China’s semiconductor sector has witnessed remarkable growth, driven by a national strategy to reduce reliance on foreign technology. Prominent companies like Huawei and SMIC have been pivotal in this initiative. SiCarrier, reportedly backed by Huawei, has also made substantial strides in this direction. At the SEMICON 2025 event in China, the company unveiled its latest suite of equipment, boldly indicating its intent not to lag behind.
According to details revealed at SEMICON and shared by user @zephyr_z9, SiCarrier’s new catalog boasts an array of chipmaking tools, including Rapid Thermal Processing (RTP) systems used in semiconductor manufacturing for integrated circuit devices. While the catalog contains numerous innovations, it notably excludes lithography tools, possibly hinting at strategic developments SiCarrier might prefer to keep under wraps. This extensive product line is designed to challenge firms like ASML, Applied, and LAM, though its effectiveness in the local market remains to be seen.
During SEMICON, Du Lijun, President of SiCarrier, claimed that their domestic chip tools can produce 5nm chips. However, using non-optical technologies presents yield rate challenges, resulting in higher production costs compared to international options. SiCarrier is collaborating with SMIC and Huawei to navigate these obstacles. Given the strategic significance of achieving chip production independence for China, a significant breakthrough seems anticipated.
“We might find a way to utilize non-optical technologies,” remarked Du Lijun in a statement reported by Reuters, “by applying our process equipment to address some lithography challenges.”
SiCarrier’s overarching goal is to shift the semiconductor landscape, reducing dependency on countries like the Netherlands, a central hub for chipmaking tools. Previously, it was reported that SiCarrier is partnering with Huawei and the Shenzhen government to develop specialized EUV prototypes centered on laser-induced discharge plasma (LDP). This initiative marks the initial step toward China establishing its EUV lithography capabilities, potentially overcoming one of the last hurdles to achieving its advanced technological nodes.
